Equipment Automation System (EAP)

Enables production automation, enhancing operational efficiency and yield while reducing manufacturing costs.

Pain Points
User Value
Core Advantages
Application Scenarios
Cases
Functional Modules

Pain Points

1. Absence of standardized equipment communication interfaces, low connectivity maturity, high networking costs and limited visibility into equipment operations.

2. Machine programs are encrypted, preventing data extraction; legacy equipment lacks data collection capabilities or PLCs cannot support additional networking modules, making expansion difficult.

3. No unified equipment bus platform, resulting in fragmented data, persistent silos and limited end-to-end control and traceability.

4. Manual machine data collection leads to heavy workloads and a high risk of human error.

User Value

Collects and manages data from different factories, production lines, and machines in one place, ensuring the information is complete, up-to-date and reliable.

Integrates with systems like MES, FDC and RMS to give full visibility and control over machine settings, status, recipes, materials and work-in-progress.

Supports intelligent production by helping factories increase equipment utilization, boost efficiency and yield and reduce production costs.

Enables equipment automation to reduce manual intervention, minimize errors, improve data accuracy and timeliness and enhance on-site production efficiency.

Core Advantages

Efficient Management of Machine Equipment
Supports semiconductor-standard communication protocols (SECS/HSMS/GEM), features intuitive visual modeling and provides comprehensive tracking of equipment status and key parameters.
System Stable and Reliable
Stable, high-speed data processing, robust exception handling and a mature, reliable system framework.
Fast Data Connection
Supports database table mapping and enables seamless integration with MES and other enterprise systems.
Rich Interfaces, Strong Compatibility
Built on modular service components, with support for diverse application interfaces such as MQ, TIB/RV, JMS, and SOAP.

Application Scenarios

Chip Industry

Semiconductor material crystal growth and slicing, chip manufacturing, packaging, design companies

Panel Industry

OLED panel manufacturing and assembly companies

Photovoltaic Industry

Crystal growth and slicing, photovoltaic chip manufacturing, photovoltaic module companies

PCB and Other Industries

Printed circuit board industry and other industries requiring engineering data integration and analysis

Cases

Case: EAP Equipment Automation System Achieves Localization, Helps Wafer Fab Reduce Costs and Increase Efficiency

Customer Needs:
Enable localized replacement of the existing EAP system while supporting systematic management and automated production for new lines. GTRONTEC's EAP solution addresses both requirements in a single platform.

Customer Benefits:
- Seamless integration of the EAP system with upstream and downstream systems, enabling real-time process visibility and improving production efficiency by 20%
- Collection of WIP process and equipment utility data, with managed sampling rules, resulting in a 3% increase in product yield
- Full control of product input and output across equipment lines, reducing labor dependency and lowering overall factory costs by 10%

Functional Modules

1. Communication Bridge:
Enables bidirectional data exchange, collecting equipment data for upstream systems and dispatching instructions from upper systems to the equipment layer

2. Equipment Integration:
Flexibly integrates upstream and downstream equipment virtually, aligned with actual business processes

3. Production Management & Control:
Tracks product information, manages equipment data, and controls production operations across equipment lines

4. Intelligent Parameter Management:
Manages process and equipment parameters, with real-time monitoring and tracking of production data